Tech Team · Kintek Solution

In thermal evaporation of PVD, the source material is vaporized by heating it to a high temperature in a vacuum environment. The vaporized material then travels in a straight path (line of sight) to the substrate, where it condenses to form a thin film. This process is characterized by minimal interference and contamination, as the vacuum environment reduces the presence of gaseous contaminants.

1. Heating the source material: The source material is heated to a sufficiently elevated temperature, typically using a tungsten wire coil or a high-energy electron beam. This causes the material to vaporize, creating a vapor flux.
2. Vacuum environment: The process is carried out in a high-vacuum environment, with gas pressure ranging from 0.0013 Pa to 1.3 × 10^-9 Pa. This ensures that the evaporated atoms undergo essentially collisionless transport from the source to the substrate, minimizing contamination and interference.
3. Vapor transport and condensation: The vaporized material travels in a straight path (line of sight) to the substrate, where it condenses to form a thin film. The vacuum environment plays a crucial role in preventing contamination of the coating formed.
4. Deposition rate: The rate of mass removal from the source material due to evaporation increases with vapor pressure, which in turn increases with the applied heat. A vapor pressure greater than 1.5 Pa is needed to achieve high enough deposition rates for manufacturing purposes.

Overall, thermal evaporation is a gentle PVD method with low power consumption requirements, producing evaporated particle energies of approximately 0.12 eV (1500 K). It is a relatively simple process compared to other PVD methods, such as sputter deposition or arc deposition.

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