The material used for PVD (Physical Vapor Deposition) primarily includes metals, alloys, metal oxides, and some composite materials. These materials are vaporized from a solid source in a high vacuum and then condense on a substrate to form thin films. The materials can be pure atomic elements, such as metals and non-metals, or molecules like oxides and nitrides. Common examples of materials used in PVD include Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, SiO2, ITO, and CuNi.
Explanation:
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Metals and Alloys: These are commonly used in PVD due to their conductivity and durability. Examples include chromium (Cr), gold (Au), nickel (Ni), aluminum (Al), platinum (Pt), palladium (Pd), titanium (Ti), tantalum (Ta), and copper (Cu). These materials are chosen based on the specific properties required for the application, such as resistance to corrosion, electrical conductivity, or mechanical strength.
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Metal Oxides: These materials are used for their dielectric properties or to provide a barrier against moisture and other environmental factors. Silicon dioxide (SiO2) is a common example used in semiconductor and optical applications.
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Composite Materials and Compounds: These include materials like indium tin oxide (ITO) and copper-nickel (CuNi), which are used for their unique properties such as transparency and conductivity in the case of ITO, which is used in touch screens and solar cells. Compounds like titanium nitride (TiN), zirconium nitride (ZrN), and tungsten silicide (WSi) are also deposited using PVD for their hardness and wear resistance, often used in cutting tools and decorative coatings.
Methods of Deposition:
- Thermal Evaporation: The material is heated to its vaporization point and then condenses on the substrate.
- Sputter Deposition: A target material is bombarded with ions, causing it to eject atoms that then deposit on the substrate.
- Pulsed Laser Deposition (PLD): A laser pulse is used to vaporize the material, which then deposits on the substrate.
These methods allow for precise control over the thickness and composition of the deposited films, ranging from a few angstroms to thousands of angstroms in thickness. The choice of material and deposition method depends on the specific requirements of the application, such as the desired mechanical, optical, chemical, or electronic properties of the final product.
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