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KinTek offers a range of lab consumables and materials, including evaporation materials, targets, metals, electrochemistry parts, as well as powders, pellets, wires, strips, foils, plates, and more.
Copper Nickel Indium Alloy (CuNiIn) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CuNiIn
Aluminum Copper Alloy (AlCu) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlCu
Cobalt Silicide (CoSi2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CoSi2
Zirconium Silicon Alloy (ZrSi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZrSi
Nickel Silicon Alloy (NiSi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiSi
Zirconium Silver Alloy (ZrAg) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZrAg
Tin Bismuth Silver Alloy (SnBiAg) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-SnBiAg
Chromium Nickel Alloy (CrNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CrNi
Nickel Aluminum Alloy (NiAl) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiAl
Nickel Niobium Alloy (NiNb) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiNb
Iron Nickel Alloy (FeNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-FeNi
Manganese Cobalt Nickel alloy (MnCoNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-MnCoNi
Boron Nitride (BN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-BN
Aluminum Nitride (AlN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlN
Silicon Nitride (Si3N4) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-Si3N4
Titanium Nitride (TiN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TiN
Tantalum Nitride (TaN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TaN
Zinc Sulfide (ZnS) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZnS
Molybdenum Sulfide (MoS2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-MoS2
Tin Sulfide (SnS2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-SnS2
Tungsten Sulfide (WS2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-WS2
Cadmium Sulfide (CdS) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CdS
Boron Carbide (B4C) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-B4C
Hafnium Carbide (HfC) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-HfC
Tungsten Carbide (WC) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-WC
Molybdenum Carbide (Mo2C) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-Mo2C
Aluminum Boride (AlB2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlB2
Titanium Carbide (TiC) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TiC
Boron Carbide (BC) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-BC
Silicon Carbide (SiC) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-SiC
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Explores the use of hot isostatic pressing in producing high-quality sputtering targets and the applications of PVD sputtering technology.
This article discusses the manufacturing and optimization of PVD sputtering targets, focusing on techniques like hot isostatic pressing and high pressure heat treatment.
An overview of the use of isostatic graphite in various stages of photovoltaic production and its market demand.
Dive into the world of Spark Plasma Sintering (SPS) furnaces, their innovative technology, and applications in material science. Learn how SPS furnaces revolutionize the sintering process with high-speed, efficiency, and precision.
Precautions when installing MoSi2 heating elements
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Learn about the scientific principle of sieving, including the process of separating particles based on size, types of laboratory test sieves. Discover how sieving impacts various industries and the accuracy of particle sizing measurements.
Discover the transformative potential of molybdenum vacuum furnaces in aerospace, automotive, and various other industries. Learn about their advanced features, applications, and insulation techniques for high-performance operations.
Discover the world of Spark Plasma Sintering Furnaces (SPS). This comprehensive guide covers everything from its advantages and applications to its process and equipment. Learn how SPS furnaces can revolutionize your sintering operations.
Cold Isostatic Pressing (CIP) and Hot Isostatic Pressing (HIP) are two powder metallurgy techniques used to produce dense and high-quality metal components.
Hot Isostatic Pressing(HIP ) is a technology used to densify materials at high temperatures and pressures. The process involves placing a material in a sealed container, which is then pressurized with an inert gas and heated to a high temperature.
Hot Isostatic Pressing (HIP) is a powerful manufacturing process that plays a crucial role in enhancing the density of ceramic materials and reducing porosity in metals. It is widely utilized in various industries, including aerospace, powder metallurgy, and component manufacturing.
Cold isostatic pressing (CIP) services utilize extremely high pressures to sterilize products or cold compact powders. CIP is particularly effective in producing complex shapes and increasing the final density of materials.
Cold Isostatic Pressing (CIP) is a process used to compact powders into a specific shape or size. This method involves subjecting the powders to high pressure, typically between 100 and 200 MPa, in a liquid medium.
Lab presses are an essential tool in research and development for a wide range of industries, including pharmaceuticals, materials science, and electronics.
Cold Isostatic Pressing (CIP) is a powder compaction technique that involves applying uniform pressure to a powder-filled container from all directions.
Cold isostatic pressing (CIP) is a method of processing materials by using liquid pressure to compact powder. It is similar to metal mold processing and is based on Pascal's law.
Warm Isostatic Pressing (WIP) is a high-pressure technique used to enhance the density and reduce the defects of materials. It involves subjecting a material to high pressure and high temperature while simultaneously applying an inert gas, which uniformly compresses the material.
Isostatic pressing is a process used in the production of high-performance materials and components. It involves applying uniform pressure on all sides of a material or part, resulting in a more uniform density and improved mechanical properties.
Cold Isostatic Pressing (CIP) is a process used to compact and densify powders, ceramics, and metals. This process uses high-pressure fluids, usually water or oil, to apply uniform pressure to the material from all directions.