The process of deposition precipitation involves the creation of thin or thick layers of a substance on a solid surface through various methods, such as spraying, spin coating, plating, and vacuum deposition. These layers are formed atom-by-atom or molecule-by-molecule, altering the properties of the substrate surface based on the application. The thickness of these layers can range from a single atom (nanometer) to several millimeters, depending on the coating method and material type.
Several deposition methods exist, including physical vapor deposition (PVD) and chemical vapor deposition (CVD). PVD involves high-energy techniques that vaporize solid materials in a vacuum for deposition onto a target material. Two PVD methods are sputtering and evaporation. Magnetron sputtering, a plasma-based PVD method, utilizes plasma ions to interact with the material, causing atoms to sputter and form a thin film on the substrate. This method is commonly used in electrical or optical production settings.
CVD, on the other hand, involves the deposition of a solid film on a heated surface due to a chemical reaction in a vapor phase. This thin-film process typically consists of three steps: evaporation of a volatile compound, thermal decomposition of the vapor into atoms and molecules, and deposition of nonvolatile reaction products on the substrate. CVD requires pressures ranging from a few torr to above atmospheric pressure and relatively high temperatures (about 1000°C).
In summary, deposition precipitation is a process that creates layers of a substance on a solid surface through various methods, altering the substrate's properties. PVD and CVD are two common deposition techniques, each with unique methods and requirements for creating thin films on substrates.
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