Vacuum evaporation is a Physical Vapor Deposition (PVD) process where material is vaporized from a source and deposited onto a substrate without colliding with gas molecules in the space between the source and the substrate.
This process occurs in a vacuum environment with a gas pressure range of 10^-5 to 10^-9 Torr, ensuring minimal contamination of the deposited film.
The vaporized material must reach a temperature where its vapor pressure is at least 10 mTorr for an appreciable deposition rate.
Vaporization sources can be heated using resistive methods for temperatures below 1,500°C, or high-energy electron beams for any temperature.
The trajectory of the vaporized material is "line-of-sight," meaning it travels directly from the source to the substrate.
What is Vacuum Evaporation in PVD? 5 Key Points Explained
1. Vacuum Environment
Vacuum evaporation occurs in a vacuum environment with a gas pressure range of 10^-5 to 10^-9 Torr.
This ensures minimal contamination of the deposited film.
2. Vapor Pressure Requirement
The vaporized material must reach a temperature where its vapor pressure is at least 10 mTorr for an appreciable deposition rate.
3. Heating Methods
Vaporization sources can be heated using resistive methods for temperatures below 1,500°C, or high-energy electron beams for any temperature.
4. Line-of-Sight Trajectory
The trajectory of the vaporized material is "line-of-sight," meaning it travels directly from the source to the substrate.
5. Thin Film Formation
In the context of PVD, vacuum evaporation is one of several methods used to apply thin films onto substrates by transforming solid coating material into a vapor.
This vapor then recondenses on the substrate surface to form the coating.
The vacuum environment is crucial as it allows even low vapor pressure materials to produce a vapor cloud, which can then traverse the chamber and adhere to the substrate surface as a thin film coating.
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