There are three primary types of Physical Vapor Deposition (PVD) methods for thin films: Sputtering, Thermal Evaporation, and Electron-beam Evaporation (e-beam evaporation).
Sputtering is a process where the target material is bombarded with a high-energy electrical charge, causing atoms or molecules to be "sputtered" off and deposited onto a substrate. This method includes ion beam-assisted deposition, reactive sputtering, and magnetron sputtering. The plasma is generated under high voltage between the source material and the substrate.
Thermal Evaporation involves elevating the coating material to its boiling point in a high vacuum environment. This causes the material to vaporize and form a vapor stream that rises in the vacuum chamber and then condenses on the substrate, forming a thin film. In this process, an electric current heats the target material, melting it and evaporating it to a gaseous phase.
Electron-beam Evaporation (e-beam evaporation) uses an electron beam to heat the target material, causing it to evaporate and deposit onto the substrate. This method is similar to thermal evaporation but uses an electron beam for heating, which can provide more precise control over the evaporation process.
Each of these methods has unique characteristics and is chosen based on the specific requirements of the application, including the type of material to be deposited, the desired film properties, and the conditions within the deposition chamber.
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