Vacuum vapor deposition of gold is a process used to deposit a thin layer of gold onto various surfaces, such as circuit boards, metal jewelry, or medical implants.
This process is a type of physical vapor deposition (PVD) and is carried out in a vacuum chamber to ensure the gold atoms adhere properly to the substrate without interference from air or other gases.
4 Key Steps Explained
1. Vacuum Creation
The first step involves creating a vacuum in a chamber to eliminate air and other gases that could interfere with the deposition process.
This ensures that the gold atoms can travel directly to the substrate without contamination or adhesion issues.
2. Substrate Preparation
The object to be coated, known as the substrate, is placed in the vacuum chamber.
Depending on the application, the substrate might need cleaning or other preparations to ensure optimal adhesion of the gold layer.
3. Material Evaporation or Sputtering
In the case of gold, the process typically involves sputtering.
A gold target material is placed in the chamber and bombarded with high-energy ions.
This bombardment causes the gold atoms to be ejected or "sputtered" into a fine vapor.
4. Deposition
Once the gold atoms are in a vapor state, they are deposited onto the substrate.
This deposition occurs at the atomic or molecular level, allowing for precise control over the thickness and uniformity of the gold layer.
The layer can range from a single atom thick to several millimeters, depending on the application requirements.
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