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KinTek sample preparation equipment includes sample crushing,milling, as while as while sieving equipment, hydraulic press equipment includes manual press, electric press, isostatic press, hot press and press filtering machine.
KinTek supplies a broad range of high-temperature furnaces, including lab, pilot production, and industrial production furnaces, with a temperature range of up to 3000 ℃. One of KinTek's advantages is the ability to create custom-made furnaces tailored to specific functions, such as different heating methods and speeds, extra high and dynamic vacuums, controlled atmospheres and gas circuits, automated mechanical structures, and software and hardware development.
KinTek offers a range of lab consumables and materials, including evaporation materials, targets, metals, electrochemistry parts, as well as powders, pellets, wires, strips, foils, plates, and more.
KinTek bio-chem equipment comprises rotary evaporators, glass and stainless steel reactors, distillation systems, circulating heaters and chillers, as well as vacuum equipment.
Tantalum Tungsten Alloy (TaW) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TaW
Titanium Silicon Alloy (TiSi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TiSi
Tungsten Titanium Alloy (WTi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-WTi
Titanium Nickel Silver Alloy (TiNiAg) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TiNiAg
Lithium Aluminum Alloy (AlLi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlLi
Aluminum Chromium Alloy (AlCr) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlCr
Nickel Chromium Alloy (NiCr) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiCr
Iron Gallium Alloy (FeGa) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-FeGa
Cobalt Telluride (CoTe) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CoTe
Copper Zirconium Alloy (CuZr) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CuZr
Copper Nickel Alloy (CuNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CuNi
Copper Nickel Indium Alloy (CuNiIn) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CuNiIn
Aluminum Copper Alloy (AlCu) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlCu
Cobalt Silicide (CoSi2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CoSi2
Zirconium Silicon Alloy (ZrSi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZrSi
Nickel Silicon Alloy (NiSi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiSi
Zirconium Silver Alloy (ZrAg) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZrAg
Tin Bismuth Silver Alloy (SnBiAg) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-SnBiAg
Chromium Nickel Alloy (CrNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-CrNi
Nickel Aluminum Alloy (NiAl) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiAl
Nickel Niobium Alloy (NiNb) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-NiNb
Iron Nickel Alloy (FeNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-FeNi
Manganese Cobalt Nickel alloy (MnCoNi) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-MnCoNi
Boron Nitride (BN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-BN
Aluminum Nitride (AlN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-AlN
Silicon Nitride (Si3N4) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-Si3N4
Titanium Nitride (TiN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TiN
Tantalum Nitride (TaN) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-TaN
Zinc Sulfide (ZnS) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-ZnS
Molybdenum Sulfide (MoS2) Sputtering Target / Powder / Wire / Block / Granule
Item Number : LM-MoS2
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Hot Isostatic Pressing(HIP ) is a technology used to densify materials at high temperatures and pressures. The process involves placing a material in a sealed container, which is then pressurized with an inert gas and heated to a high temperature.
Hot Isostatic Pressing (HIP) is a powerful manufacturing process that plays a crucial role in enhancing the density of ceramic materials and reducing porosity in metals. It is widely utilized in various industries, including aerospace, powder metallurgy, and component manufacturing.
Cold isostatic pressing (CIP) services utilize extremely high pressures to sterilize products or cold compact powders. CIP is particularly effective in producing complex shapes and increasing the final density of materials.
Warm Isostatic Press (WIP) is a type of isostatic press that uses a combination of heat and pressure to create high-quality parts. The WIP process involves placing a part inside a flexible mold, which is then filled with a gas or liquid media.
Isostatic presses play a crucial role in various industries, offering unique capabilities for material consolidation and product creation. These powerful machines apply equal pressure from all directions, resulting in products with uniform density and reduced defects. Isostatic presses are divided into two main types: Cold Isostatic Presses (CIP) and Hot Isostatic Presses (HIP). Each type functions under different conditions, allowing for a wide range of applications.
Lab presses are an essential tool in research and development for a wide range of industries, including pharmaceuticals, materials science, and electronics.
Cold isostatic pressing (CIP) is a method of processing materials by using liquid pressure to compact powder. It is similar to metal mold processing and is based on Pascal's law.
Warm Isostatic Pressing (WIP) is a high-pressure technique used to enhance the density and reduce the defects of materials. It involves subjecting a material to high pressure and high temperature while simultaneously applying an inert gas, which uniformly compresses the material.
The two most common techniques used for thin film deposition are evaporation and sputtering.
Tungsten has a number of properties that make it well-suited for use in high-temperature furnaces.
In X-ray fluorescence (XRF) analysis, sample preparation is an important step because it can significantly impact both the quality and the efficiency of the analysis.